1156B

1156B Specifications

Manufacturer: CoolJag
Part Number: 1156B
Product Type: Backplate
Application: Compatible with Intel® Xeon® 3400 Series & Core® i5 & i3 processors for Socket 1156/1155/1150
Dimensions: 84 mm (L) x 84 mm (W) x 26.4 mm (H)
Material: Copper
Weight: 424 g
PWM Function: Yes
Thermal Grease: Shin-Etsu 7762 pre-applied
Fan Specifications:

• Fan Size: 70 mm x 70 mm x 10 mm

• Fan Voltage: 12V

• Bearing Type: Dual Ball Bearing

• Fan Speed: 1200 to 5500 rpm

• Noise Level: 19 to 45 dBA

• Air Flow: 6.96 to 32.93 CFM

• Power Consumption: 1.2 to 5.4 W

• Static Pressure: 0.2 to 4.5 mmH2O

• Fan Connector: 4-pin

• Lead Wire: UL1061 #26AWG or equivalent

• Pin Assignment: Pin 1 – Black (GND), Pin 2 – Yellow (PWR), Pin 3 – Green (SGN), Pin 4 – Blue (PWM)
  RoHS Status: RoHS Compliant

Key Features

The 1156B backplate by CoolJag is engineered to provide robust support and enhanced cooling performance for Intel® Xeon® 3400 Series and Core® i5 & i3 processors utilizing Socket 1156/1155/1150. Constructed from high-quality copper, the backplate ensures optimal thermal conductivity and durability. Its dimensions of 84 mm by 84 mm with a height of 26.4 mm allow for a compact yet effective cooling solution. The inclusion of a PWM-controlled fan with dual ball bearings offers adjustable speeds ranging from 1200 to 5500 rpm, balancing cooling efficiency and noise levels to suit various operational requirements. Pre-applied Shin-Etsu 7762 thermal grease facilitates superior heat transfer between the processor and the cooling assembly, enhancing overall thermal management.

Applications

The 1156B backplate is ideally suited for systems requiring reliable and efficient cooling solutions for Intel® processors in the Xeon® 3400 Series and Core® i5 & i3 families. Its design and features make it particularly beneficial for high-performance computing environments, gaming rigs, and workstations where maintaining optimal processor temperatures is critical to system stability and longevity.

Product Overview

CoolJag’s 1156B backplate offers a comprehensive cooling solution tailored for specific Intel® processors, emphasizing both performance and ease of installation. The copper construction provides excellent heat dissipation, while the PWM function allows for dynamic fan speed adjustments to balance cooling needs and acoustic levels. The compact design ensures compatibility with various system configurations without compromising on cooling efficiency. Additionally, the pre-applied Shin-Etsu 7762 thermal grease simplifies the installation process, ensuring consistent thermal performance. Overall, the 1156B backplate stands out as a reliable component for enhancing processor cooling in compatible systems.

Contact Us

For additional information regarding our products, feel free to get in touch with us. You can call us at 770-870-1760 or email us at info@Cyndtek.com. We look forward to assisting you and ensuring your satisfaction with all of our Cyndtek products.