ACA-SPI-006-K01 Specifications
Manufacturer: LOTES
Part Number: ACA-SPI-006-K01
Product Type: SPI Flash Memory IC Socket
Socket Type: SOIC-16
Number of Positions: 16
Contact Configuration: 2 Rows × 8 Positions
IC Body Width: 300 mil / 7.62 mm
Contact Pitch: 1.27 mm / 0.050 inch
Mounting Style: Surface Mount (SMD)
Termination Type: Solder
Body Orientation: Straight
Contact Material: Phosphor Bronze
Contact Finish: Gold
Contact Plating Thickness: 1.00 µin / 0.025 µm
Housing Material: Liquid Crystal Polymer (LCP)
Flammability Rating: UL94 V-0
Contact Resistance: 30 mΩ
Socket Features: Closed Frame, Board Guide
Packaging: Tape and Reel
Compliance: RoHS Compliant
Key Features
16-position SOIC SPI flash memory socket
300 mil SOIC-16 IC package compatibility
1.27 mm contact pitch
Dual-row 2 × 8 contact configuration
Gold-plated phosphor bronze contacts
Surface-mount solder termination
Closed-frame socket construction
Integrated board guide for PCB alignment
LCP housing with UL94 V-0 flammability rating
Suitable for SPI flash development and testing
Applications
SPI flash memory interfaces
Embedded system development
BIOS and firmware development
Industrial controller boards
Flash memory programming fixtures
Electronic test equipment
Prototype circuit board assemblies
Motherboard development and repair
Microcontroller support circuits
OEM electronic manufacturing
Product Overview
The ACA-SPI-006-K01 from LOTES is a 16-position SOIC socket for SPI flash memory devices. It supports compatible 300 mil-wide SOIC-16 integrated circuits. In addition, its surface-mount design helps engineers integrate removable IC connections into compact electronic assemblies.
This socket features a dual-row configuration with eight contacts on each side. The 1.27 mm pitch matches compatible SOIC package requirements. As a result, designers can accommodate supported memory devices without permanently soldering each IC into place.
The ACA-SPI-006-K01 uses gold-plated phosphor bronze contacts for reliable electrical connections. Its housing consists of liquid crystal polymer material. Furthermore, the UL94 V-0 flammability rating supports use in professional electronic assemblies.
The closed-frame design helps maintain proper component positioning. It also includes a board guide for improved alignment during PCB assembly. Therefore, the socket is useful for development boards, test fixtures, and embedded computing platforms.
Engineers can use this component in SPI flash memory development and firmware testing. For example, it can support applications that require frequent IC replacement or testing. The removable socket arrangement also simplifies selected maintenance and troubleshooting tasks.
The ACA-SPI-006-K01 supports surface-mount solder assembly. Consequently, it integrates into compatible PCB layouts without traditional through-hole mounting. Its compact construction makes it suitable for industrial controllers, computing hardware, and electronic development systems.
This component provides the physical socket interface only. It does not independently program or communicate with flash memory devices. Therefore, applications requiring programming functions must use compatible external circuitry or programming equipment.
Cyndtek® supplies connectors, IC sockets, semiconductors, and hard-to-find electronic components for OEM, repair, test, and production applications. To request pricing or availability for ACA-SPI-006-K01, visit our Cyndtek shop or contact sales@cyndtek.com with your quantity, target price, and required delivery schedule.
