BSP317P H6327

BSP317P H6327

$0.50

P-Channel 30V Logic-Level MOSFET
  • Manufacturer: Diodes Inc
  • Part Number: BSP317P H6327
  • Packaging: Bulk
  • Quantity: Each
  • Datecode: 2216

Availability: 35 in stock

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SKU ca001-28 Category Brand:

BSP317P H6327 Specifications

Manufacturer: Diodes Incorporated
Part Number: BSP317P H6327
Device Type: P-Channel MOSFET
Drain-Source Voltage (V<sub>DS</sub>): -20 V
Continuous Drain Current (I<sub>D</sub>): -2.3 A
R<sub>DS(on)</sub>: Low on-resistance at specified gate drive
Gate Threshold Voltage: Logic-level compatible
Package Type: SOT-23
Mounting Type: Surface mount
Transconductance: Moderate performance for efficient switching
Operating Temperature Range: -55 °C to +150 °C

Key Features

The BSP317P H6327 delivers efficient P-channel MOSFET switching in a compact SOT-23 package. Additionally, its low on-resistance supports reduced conduction losses. Moreover, logic-level gate compatibility simplifies interfacing with low-voltage control logic. Furthermore, the surface mount format enables automated PCB assembly.

Applications

High-side switch configurations
Battery management circuits
Load switch applications
Power sequencing controllers
Portable and battery-powered devices
Telecommunications power stages
Embedded system power control
General purpose switching needs

Product Overview

The Diodes Incorporated BSP317P H6327 P-Channel MOSFET is designed for efficient switching and power control in compact electronic systems. Specifically, it supports a drain-source voltage of -20 V and continuous drain current of -2.3 A, which suits moderate-power applications. As a result, designers can implement high-side switching without complex driver circuitry. Moreover, the MOSFET’s logic-level gate threshold improves compatibility with low-voltage digital control signals. Therefore, system integration becomes more straightforward.

In addition, the low on-resistance characteristic helps minimize conduction losses and thermal buildup. Furthermore, the SOT-23 surface mount package supports automated assembly and high-density PCB layouts. Consequently, this part integrates well into compact designs requiring dependable switching elements. Because of its extended operating temperature range, the BSP317P H6327 performs reliably across varied environmental conditions. Therefore, it remains a practical solution for power control and switching applications in modern electronics.

Contact Us

For volume pricing, product availability, and additional product options, Cyndtek is ready to help. Moreover, our team supports OEMs, CMs, and engineers with dependable component solutions. Please contact us today to discuss your requirements.
Email: Sales@Cyndtek.com

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BSP317P H6327BSP317P H6327
$0.50

Availability: 35 in stock

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