DF19G-20P-1H(54)

DF19G-20P-1H(54) Specifications

Manufacturer: Hirose Electric Co., Ltd.
Part Number: DF19G-20P-1H(54)
Product Type: Board-to-Board Connector
Number of Positions: 20
Mounting Type: Surface Mount
Contact Type: Male Pin
Contact Finish: Gold
Pitch: 1.0mm
Stacking Height: 1mm
Number of Rows: 2
Current Rating: 0.3A per contact
Voltage Rating: 50V AC/DC
Operating Temperature Range: -35°C to +85°C
Package / Case: SMD
Mating Style: Push-in
Termination Style: Solder
RoHS Status: RoHS Compliant

Key Features

The DF19G-20P-1H(54) is a compact, low-profile board-to-board connector from Hirose designed for high-density signal transmission. It features a 1.0mm pitch and a 1mm stacking height, making it ideal for slim, space-constrained electronic devices. With 20 gold-plated contacts arranged in two rows, it ensures reliable signal integrity and corrosion resistance. The surface-mount design and push-in mating style support easy integration and secure connections in automated assembly environments. Its compliance with RoHS standards and suitability for low-voltage applications make it an excellent solution for a wide variety of compact PCB designs.

Applications

Mobile and handheld devices
Portable consumer electronics
Medical instrumentation
Compact industrial controllers
Wearable technology
High-density embedded systems

Product Overview

The DF19G-20P-1H(54) from Hirose offers a dependable and space-efficient solution for board-to-board interconnect applications. With its fine 1.0mm pitch and ultra-low 1mm stacking height, it is optimized for compact electronic systems where vertical space is at a premium. The gold-plated contacts deliver superior conductivity and corrosion resistance, helping to maintain signal clarity even in demanding operating environments. In addition, its surface-mount form factor simplifies PCB layout and assembly, while the push-in mating style offers secure and consistent connectivity. Designed to support up to 0.3A per contact and a voltage rating of 50V, this connector is ideal for signal-level interconnects in space-limited products. Whether in mobile electronics or embedded platforms, the DF19G-20P-1H(54) provides a balance of performance, footprint efficiency, and reliability.

Contact Us

For additional information regarding our products, feel free to get in touch with us. You can call us at 770-870-1760 or email us at info@Cyndtek.com. We look forward to assisting you and ensuring your satisfaction with all of our Cyndtek products.

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