MT53E1G32D2FW-046 IT:C Specifications
Manufacturer: Micron Technology
Part Number: MT53E1G32D2FW-046 IT:C
Memory Type: LPDDR4 SDRAM
Density / Capacity: 32 Gbit (4 GB)
Organization: 1G × 32
Data Rate / Speed Grade: 4266 MT/s (2133 MHz)
Supply Voltages (Nominal): VDD1 1.8 V, VDD2 1.1 V, VDDQ 1.1 V
Package / Case: TFBGA-200, 10 × 14.5 mm
Ball Count: 200
Bus Width: x32
Operating Temperature: −40 °C to +95 °C (IT grade)
Architecture: 16n prefetch, 8 internal banks
Timing / Features: Programmable R/W latencies, on-die termination, selectable drive strength
Power Management: Partial-Array Self-Refresh, per-bank refresh, temperature-compensated self-refresh
Compliance: RoHS compliant
Key Features
This 32 Gbit LPDDR4 delivers high bandwidth at low power for space-constrained designs. The x32 bus and 16n prefetch enable strong sustained throughput, while per-bank refresh and PASR reduce unnecessary power draw. Furthermore, on-die termination, selectable drive strength, and programmable latencies make board-level tuning straightforward. The rugged IT temperature rating expands use into harsher environments without sacrificing performance.
Applications
Automotive infotainment head units
Industrial HMIs and gateways
High-resolution single-board computers
Drones and robotics controllers
Smart cameras and edge AI modules
Product Overview
The MT53E1G32D2FW-046 IT:C is a 4 GB LPDDR4 component optimized for bandwidth, footprint, and efficiency. It reaches 4266 MT/s while maintaining low operating voltages, helping designers hit power budgets without throttling memory speed. Additionally, the 200-ball 10 × 14.5 mm TFBGA simplifies routing on dense PCBs, and the x32 interface matches common SoC memory controllers. Because it supports temperature-compensated self-refresh, PASR, and per-bank refresh, systems can intelligently trade power for responsiveness. Consequently, this device fits mobile, embedded, and automotive designs that demand reliable high-speed memory across −40 °C to +95 °C.
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