S70FS01GSAGBHI210 Specifications:
- Access Time: 6 ns (for certain operations) | 8 ns (for others)
- Flash Memory Type: NOR
- IC Case / Package: FBGA
- IC Mounting: Surface Mount
- Interfaces: Serial-SPI
- Memory Density: 1 bit per memory cell
- Number of Pins: 24
- Operating Temperature Range: -40°C to 85°C
- Nominal Supply Voltage: 1.8V
Additional Information:
- SPI with Multi-I/O:
- SPI Clock polarity and phase modes 0 and 3
- DDR support
- Extended Addressing: 24- or 32-bit address options
- Serial Command subset and footprint compatible with S25FL1-K, S25FL-P, and S25FL-S SPI families
- Multi I/O Command subset and footprint compatible with S25FL-P, S25FL1-K, and S25FL-S SPI families
Read Features:
- Commands:
- Normal, Fast, Dual I/O, Quad I/O, DDR Quad I/O
- Modes:
- Burst Wrap, Quad Peripheral Interface (QPI)
- Additional Features:
- Serial Flash Discoverable Parameters (SFDP) and Common Flash Interface (CFI) for configuration information.
Program Capabilities:
- 256 or 512 Bytes Page Programming buffer
- Program suspend and resume
- Automatic Error Correcting Code (ECC) – internal hardware ECC with single bit error correction
Erase Options:
- Hybrid Sector Option:
- Set of eight 4 KB sectors and one 224 KB sector at the top or bottom of address space; all remaining sectors of 256 KB
- Uniform Sector Option:
- Physical uniform 256 KB blocks
- Erase suspend and resume
- Erase status evaluation
- 100,000 Program-Erase Cycles on any sector, minimum
- 20-year data retention, minimum
Security Features:
- OTP array of 1024 Bytes
- Block Protection:
- Status Register bits control protection against program or erase of a contiguous range of sectors.
- Hardware and software control options
- Advanced Sector Protection (ASP):
- Individual sector protection controlled by boot code or password
- Option for password control of read access
Technology:
- Cypress 65 nm MirrorBit Technology with Eclipse Architecture
Power and Temperature:
- Single Supply Voltage with CMOS I/O:
- 1.7V to 2.0V
- Temperature Range:
- Industrial (40 °C to +85 °C)
Package (all Pb-free):
- BGA-24 6 x 8 mm (5 x 5 ball footprint)
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