658-45AB

658-45AB Specifications

Manufacturer: Wakefield-Vette
Part Number: 658-45AB
Product Type: Heat Sink
Type: Top Mount
Package Cooled: BGA (Ball Grid Array)
Attachment Method: Thermal Tape or Adhesive (Not Included)
Shape: Square with Pin Fins
Length: 1.100 inches (27.94 mm)
Width: 1.100 inches (27.94 mm)
Fin Height: 0.450 inches (11.43 mm)
Thermal Resistance (200 LFM): 6.00°C/W
Power Dissipation @ 50°C Rise: 3.0 W
Material: Aluminum
Material Finish: Black Anodized
Mounting Type: Surface Mount
RoHS Status: RoHS Compliant

Key Features

The 658-45AB from Wakefield-Vette is a precision-engineered aluminum heat sink, designed specifically for use with BGA packages in compact or high-performance systems. Its square layout and pin fin configuration maximize surface area, which boosts airflow efficiency in forced convection environments. With a black anodized finish, it enhances both heat dissipation and corrosion resistance. Moreover, the compact dimensions and light weight support its use in space-constrained electronics. Its mounting surface is compatible with thermal tape or adhesive, making the installation process quick and flexible across various platforms. Engineers can depend on this solution to maintain low junction temperatures and extend component life.

Applications

Cooling solutions for BGA-based FPGA or microprocessor boards
Compact computing devices requiring forced convection heat dissipation
Network switches and communication equipment with passive thermal constraints
Industrial controls operating at elevated ambient temperatures
Thermal control in embedded computing and IoT platforms

Product Overview

The 658-45AB heat sink is ideal for thermal management in dense electronics where airflow is present. Built from high-conductivity aluminum and designed with a compact 1.1-inch square footprint, it addresses thermal concerns without demanding large amounts of PCB real estate. Its 0.450-inch fin height allows efficient dissipation while maintaining a low profile. As a result, it works well in applications where board space is limited and thermal loads are moderate. The black anodized finish improves both aesthetic and functional performance, offering added thermal radiation and durability. With a thermal resistance of 6.00°C/W at 200 LFM, this heat sink balances size and performance for active airflow environments.

Contact Us

For additional information regarding our products, feel free to get in touch with us. You can call us at 770-870-1760 or email us at info@Cyndtek.com. We look forward to assisting you and ensuring your satisfaction with all of our Cyndtek products.